Crystallization, morphology and distribution of Ag3Sn in Sn-Ag-Cu alloys and their influence on the vibration fracture properties

Materials Science and Engineering: A

Volumn 466, Issue 1-2, 2007, Pages 9-17

  Song, Jenn Ming ^a   Lin, Jian Jhih ^a   Huang, Chi Feng ^a   Chuang, Hsin Yi ^a  

^a NATIONAL DONG HWA UNIVERSITY   (Taiwan)

Author keywords

Pb free solder; Sn Ag Cu; Vibration fracture

Indexed keywords

CRACK PROPAGATION; CRYSTALLIZATION; DAMPING; DENDRITES (METALLOGRAPHY); DUCTILITY; EUTECTICS; FRACTURE TOUGHNESS; MORPHOLOGY; SOLIDIFICATION; TENSILE PROPERTIES; VIBRATIONS (MECHANICAL);

SOLIDIFICATION RATE; VIBRATION FRACTURE;

SOLDERING ALLOYS;

CRACK PROPAGATION; CRYSTALLIZATION; DAMPING; DENDRITES (METALLOGRAPHY); DUCTILITY; EUTECTICS; FRACTURE TOUGHNESS; MORPHOLOGY; SOLDERING ALLOYS; SOLIDIFICATION; TENSILE PROPERTIES; VIBRATIONS (MECHANICAL);

EID: 34447265528     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.04.121     Document Type: Article

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