Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder - Part I: As-cast condition

Journal of Electronic Materials

Volumn 33, Issue 11, 2004, Pages 1389-1400

  Vianco, Paul T ^a   Rejent, Jerome A ^a   Kilgo, Alice C ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Constitutive model; Creep; Reliability; Tin silver copper (Sn Ag Cu) solder

Indexed keywords

COPPER ALLOYS; CRACKS; CREEP; DEFORMATION; GRAIN BOUNDARIES; MATHEMATICAL MODELS; RELIABILITY; SILVER ALLOYS; STRAIN RATE; STRESS ANALYSIS; TEMPERATURE DISTRIBUTION; TERNARY SYSTEMS; TIN ALLOYS;

CONSTITUTIVE MODEL; CREEP BEHAVIORS; PARTICLE BOUNDARIES; TIN-SILVER-COPPER (SN-AG-CU) SOLDER;

SOLDERING ALLOYS;

EID: 10044275284     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0169-8     Document Type: Conference Paper

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