Microstructure evolution in a Pb-free solder alloy during mechanical fatigue

Materials Science and Engineering: A

Volumn 431, Issue 1-2, 2006, Pages 166-174

  Matin, M A ^a   Vellinga, W P ^b   Geers, M G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b UNIVERSITY OF GRONINGEN   (Netherlands)

Author keywords

Finite element analysis; Low cycle fatigue; Microstructure evolution; Orientation imaging microscopy; Pb free solder

Indexed keywords

DEFORMATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; IMAGING TECHNIQUES; METALLOGRAPHIC MICROSTRUCTURE;

LEAD-FREE SOLDER ALLOY; LOW CYCLE FATIGUE; MICROSTRUCTURE EVOLUTION; ORIENTATION IMAGING MICROSCOPY;

SOLDERING ALLOYS;

DEFORMATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; IMAGING TECHNIQUES; METALLOGRAPHIC MICROSTRUCTURE; SOLDERING ALLOYS;

EID: 33746597535     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.05.144     Document Type: Article

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