Investigation of the role of void formation at the Cu-to-intermetallic interface on aged drop test performance

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 1, 2007, Pages 63-73

  Liu, Yueli ^a   Gale, Shyam ^b   Johnson, R Wayne ^b  

^a INTEL CORPORATION   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

Chip scale packages (CSPs); Drop test; Intermetallics; Lead free; Reliability; Voiding

Indexed keywords

AGING OF MATERIALS; COPPER ALLOYS; CRACK PROPAGATION; FAILURE ANALYSIS; IMPACT TESTING; INTERMETALLICS; RELIABILITY ANALYSIS;

MECHANICAL DROP TEST; REFLOW CYCLE; SURFACE FINISH; VOID FORMATION;

CHIP SCALE PACKAGES;

EID: 34047129644     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.890641     Document Type: Article

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