Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part I. Microstructure characterization of bulk solder and solder/copper joints

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 39, Issue 2, 2008, Pages 340-348

  Sidhu, R S ^a,b   Chawla, N ^a  

^a Arizona State University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; CHEMICAL ANALYSIS; CREEP; METALLOGRAPHIC MICROSTRUCTURE; SOLDERED JOINTS; TIN ALLOYS;

CREEP BEHAVIOR; MICROSTRUCTURE CHARACTERIZATION;

SOLDERING ALLOYS;

EID: 38649088577     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-007-9414-0     Document Type: Article

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