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Volumn 34, Issue 2, 2005, Pages 196-211
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Tensile creep and microstructural characterization of bulk Sn3.9Ag0.6Cu lead-free solder
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Author keywords
Constitutive model; Creep; Lead free solder; Microstructural changes
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Indexed keywords
CREEP;
DATA REDUCTION;
FRICTION;
GRAIN BOUNDARIES;
INTERMETALLICS;
MICROSTRUCTURE;
SHEAR STRESS;
SOLDERING ALLOYS;
CONSTITUTIVE MODELS;
LEAD-FREE SOLDERS;
MICROSTRUCTURAL CHANGES;
TENSILE CREEP;
TIN COMPOUNDS;
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EID: 14644398543
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-005-0233-z Document Type: Article |
Times cited : (39)
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References (20)
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