메뉴 건너뛰기




Volumn 34, Issue 2, 2005, Pages 196-211

Tensile creep and microstructural characterization of bulk Sn3.9Ag0.6Cu lead-free solder

Author keywords

Constitutive model; Creep; Lead free solder; Microstructural changes

Indexed keywords

CREEP; DATA REDUCTION; FRICTION; GRAIN BOUNDARIES; INTERMETALLICS; MICROSTRUCTURE; SHEAR STRESS; SOLDERING ALLOYS;

EID: 14644398543     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0233-z     Document Type: Article
Times cited : (39)

References (20)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.