Lead-Free Ceramic Ball Grid Array: Thermomechanical Fatigue Reliability

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1421-1425

  Farooq, Mukta ^a   Goldsmith, Charles ^a   Jackson, Ray ^a   Martin, Gregory ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

Accelerated temperature cycling; Ceramic ball grid array; Lead free solder; Thermal fatigue reliability; Tin silver copper

Indexed keywords

CERAMIC MATERIALS; CRACK PROPAGATION; CRACKS; ELECTRIC RESISTANCE; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; MICROSTRUCTURE; RELIABILITY; SOLDERING ALLOYS; THERMAL CYCLING; TIN ALLOYS;

ACCELERATED TEMPERATURE CYCLING; CERAMIC BALL GRID ARRAY (CBGA); LEAD-FREE SOLDERS; THERMAL FATIGUE RELIABILITY;

MICROELECTRONICS;

EID: 0942266961     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0110-6     Document Type: Conference Paper

References (8)

1. M. Farooq, S. Ray, A. Sarkhel, and C. Goldsmith, Proc. 51st Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 978-986.
2. K.C. Norris and A.H. Landzberg, IBM J. Res. Develop. 13, 266 (1969).
3. K. Levis and A. Mawer, Proc. 50th Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2000), pp. 1198-1204.
4. B. Huang and N-C. Lee, Lead-Free Soldering Symp., SUNY, Binghamton, NY, December 1999.
5. E. Bradley, Lead-Free Soldering Symp., SUNY, Binghamton, NY, December 1999.
6. J. Bath, C. Handwerker, and E. Bradley, Circuits Assembly 11, 31 (2000).
7. P. Hart et al., Int. Packaging Strategy Symp. (San Jose, CA: Semiconductor Equipment and Materials International, 2000).
8. K.S. Kim, S.H. Huh, and K. Suganuma, Mater. Sci. Eng. A 33, 106 (2002).