SCOPUS 정보 검색 플랫폼

Volumn 52, Issue 10, 2005, Pages 1027-1031

Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn-3.5Ag solder joint specimens

(2) Telang, A U a Bieler, T R a

a Michigan State University (United States)

Author keywords

Lead free solder; OIM; Single crystal; Solidification; Texture

Indexed keywords

CHARACTERIZATION; CREEP; CRYSTAL ORIENTATION; FATIGUE OF MATERIALS; METALLOGRAPHY; MICROSTRUCTURE; POLYCRYSTALLINE MATERIALS; SILVER ALLOYS; SINGLE CRYSTALS; SOLDERING; SOLDERING ALLOYS; SOLIDIFICATION; SURFACE TREATMENT; TIN ALLOYS; VOLUME FRACTION;

LEAD-FREE SOLDERS; LEAD-TIN SOLDERS; ORIENTATION IMAGING MICROSCOPY (OIM); THERMOMECHANICAL FATIGUE (TMF);

SOLDERED JOINTS;

EID: 14544308382 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/j.scriptamat.2005.01.043 Document Type: Article

Times cited : (74)

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