Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders

Journal of Electronic Materials

Volumn 29, Issue 10, 2000, Pages 1241-1248

  Guo, F ^a   Choi, S ^a   Lucas, J P ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; SOLDERED JOINTS; SUBSTRATES; TIN ALLOYS; WETTING;

LEAD-FREE SOLDERS; NANOINDENTATION TESTING (NIT);

SOLDERING ALLOYS;

EID: 0034295603     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0019-2     Document Type: Article

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