Identification of brittle solder joints using high strain rate testing of BGA solder joints

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2007, Pages 107-112

  Pandher, Ranjit ^a   Boureghda, Monnir ^a  

^a Cookson Electronics ^*

Author keywords

Ball shear; Cold ball pull; Drop shock; High speed ball pull; Mechanical shock

Indexed keywords

BRITTLENESS; PORTABLE EQUIPMENT; PROBABILITY; RELIABILITY; SOLDERED JOINTS;

BALL SHEAR; COLD BALL PULL; DROP SHOCK; HIGH-SPEED BALL PULL; MECHANICAL SHOCK;

ELECTRONIC EQUIPMENT;

EID: 34548740253     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2007.369877     Document Type: Conference Paper

References (4)

1. S. Shetty and T. Reinikainen, "Three- and Four-Point Bend Testing for Electronic Packages," J. of Electronic Packaging, Vol. 125, No. 17 (2003), pp. 556-561.
2. JEDEC Solid State Technology Association, JESD22-B111: "Board Level Drop Test Method of Component for Handheld Electronics Products", 2003.
3. th Electronic Components and Technology Conf., Orlando, FL, May-June 2005, pp. 1194-1201.
4. th Electronic Components and Technology Conf., San Diego, CA, May-June 2006, pp. 849-864.