Effects of intermetallic morphology at the metallic particle/solder interface on mechanical properties of Sn-Ag-based solder joints

Journal of Electronic Materials

Volumn 32, Issue 11, 2003, Pages 1257-1264

  Rhee, H ^a   Guo, F ^a   Lee, J G ^a   Chen, K C ^b   Subramanian, K N ^a  

^a Michigan State University   (United States)

^b CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

Author keywords

Composite lead free solder joints; IMC morphology; Mechanical behavior

Indexed keywords

CREEP; EUTECTICS; HEATING; INTERMETALLICS; MECHANICAL PROPERTIES; MORPHOLOGY; SHEAR STRENGTH; SILVER; SOLDERED JOINTS; TEMPERATURE; TIN;

COMPOSITE LEAD FREE SOLDER JOINTS; INTERMETALLIC MORPHOLOGY; METALLIC PARTICLE SOLDER INTERFACE;

INTERFACES (MATERIALS);

EID: 0348107253     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0020-7     Document Type: Article

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