Three-Dimensional (3D) Integration

Microelectronic Applications of Chemical Mechanical Planarization

Volumn , Issue , 2007, Pages 431-465

  McMahon, J Jay ^a   Lu, Jian Qiang ^a   Gutmann, Ronald J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Deep submicron alignment and nanoimprint lithography; Face to face and face to back bonding; Wafer level processing

Indexed keywords

EID: 84885811039     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9780470180907.ch15     Document Type: Chapter

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