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Volumn 14, Issue 4, 2005, Pages 16-20

Through-wafer via etching

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CMOS INTEGRATED CIRCUITS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; INDUCTIVELY COUPLED PLASMA; INPUT OUTPUT PROGRAMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS;

EID: 18144372732     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review
Times cited : (5)

References (7)
  • 1
    • 18144366147 scopus 로고
    • Patent No. DE 4241045 (US 5501893)
    • F. Laermer, A. Schilp - Patent No. DE 4241045 (US 5501893), 1994.
    • (1994)
    • Laermer, F.1    Schilp, A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.