Performance comparison of interconnect technology and architecture options for deep submicron technology nodes

2006 International Interconnect Technology Conference, IITC

Volumn , Issue , 2006, Pages 202-204

  Bamal, Mandeep ^b   List, Scott ^c   Stucchi, Michele ^a   Verhulst, Anne S ^b   Van Hove, Marleen ^a   Cartuyvels, Rudi ^a   Beyer, Gerald ^a   Maex, Karen ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c Intel Corporation Belgium   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBES; ELECTRON ENERGY LOSS SPECTROSCOPY; ENERGY DISSIPATION; ENERGY DISSIPATORS; INTEGRATED OPTICS; INTERCONNECTION NETWORKS; NANOTECHNOLOGY; OPTICAL INTERCONNECTS;

3-D INTERCONNECTS; 45NM NODE; ARCHITECTURAL SOLUTIONS; DEEP SUB MICRON TECHNOLOGIES; GLOBAL INTERCONNECTS; INTERCONNECT PERFORMANCE; INTERCONNECT TECHNOLOGIES; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; NANO TUBE; ON CHIPS; ON-CHIP WIRES; OPTICAL-; PERFOR MANCE COMPARISON; POWER GAINS; PROPAGATION DELAYS; WAFER-LEVEL PACKAGE;

TECHNOLOGY;

EID: 45749134492     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2006.1648688     Document Type: Conference Paper

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