Global uniformity optimization and its impact on the distribution of physical and electrical properties of Cu damascene metal lines

Advanced Metallization Conference (AMC)

Volumn , Issue , 2006, Pages 495-499

  Kwak, B Leo ^a   Sun, Sey Shing ^a   Falk, Cary ^a   Burke, Peter ^a  

^a LSI Logic Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC PROPERTIES; ELECTROCHEMISTRY; ELECTRODEPOSITION; EROSION; POLISHING; CHEMICAL MECHANICAL POLISHING; METALLIZING; OPTIMIZATION;

DAMASCENE METAL LINES; GLOBAL UNIFORMITY OPTIMIZATION; LINE RESISTANCE; WAFERS; CENTER-TO-EDGE PROCESS BIASES; CU DAMASCENE METAL LINES; EROSION CHARACTERISTICS; LINE RESISTANCE VARIATIONS;

GLOBAL OPTIMIZATION; COPPER METALLURGY;

EID: 33644963194     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

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