Modeling of direct wafer bonding: Effect of wafer bow and etch patterns

Journal of Applied Physics

Volumn 92, Issue 12, 2002, Pages 7658-7666

  Turner, K T ^a   Spearing, S M ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; COMPUTER SIMULATION; ETCHING; FINITE ELEMENT METHOD; INTERFACIAL ENERGY; STRAIN;

WAFER BONDING;

SILICON WAFERS;

EID: 0037115728     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1521792     Document Type: Article

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