|
|
|
Volumn 28, Issue 12, 2005, Pages 26-
|
|
New 3-D chip interconnect technology
[No Author Info available]
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
CHEMICAL MECHANICAL POLISHING;
SEMICONDUCTOR DEVICE MANUFACTURE;
SILICA;
CHEMO-MECHANICAL POLISH;
CHIP-TO-CHIP BONDING;
INTEGRATED CIRCUITS;
|
|
EID: 33644527893
PISSN: 01633767
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Short Survey |
|
Times cited : (1)
|
|
References (0)
|