Atmospheric pressure low temperature direct plasma technology: Status and challenges for thin film deposition

Plasma Processes and Polymers

Volumn 9, Issue 11-12, 2012, Pages 1041-1073

  Massines, Francoise ^a   Sarra Bournet, Christian ^b   Fanelli, Fiorenza ^c   Naudé, Nicolas ^a,d   Gherardi, Nicolas ^a,d  

^a CNRS   (France)

^b UNIVERSITÉ DE SHERBROOKE   (Canada)

^c UNIVERSITY OF BARI   (Italy)

^d d'Hydraulique et des Telecommunications   (France)

Author keywords

Atmospheric pressure cold plasmas; Direct deposition; Plasma enhanced chemical vapor deposition (PECVD); Reactors; Thin films

Indexed keywords

ATMOSPHERIC PRESSURE PLASMAS; COLD PLASMAS; DIRECT DEPOSITION; DIRECT PLASMA; LABORATORY REACTORS; LOW TEMPERATURES; POWDER FORMATION; REFERENCE POINTS; SCIENTIFIC PRINCIPLES; STATE OF THE ART; THIN-FILM DEPOSITIONS; THIN-FILM PROPERTIES;

ATMOSPHERIC PRESSURE; DEPOSITION; FILM GROWTH; INDUSTRIAL APPLICATIONS; NUCLEAR REACTORS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; THIN FILMS; VAPOR DEPOSITION; VAPORS;

PLASMAS;

EID: 84872316634     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.201200029     Document Type: Review

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