Soft Plasma polymerization of gas state precursors from an atmospheric pressure corona plasma discharge

Chemistry of Materials

Volumn 21, Issue 19, 2009, Pages 4401-4407

  Herbert, P Anthony F ^a   O'Neill, Liam ^b   Jaroszýnska Wolínska, Justyna ^c  

^a Plasma Ireland Ltd   (Ireland)

^b Irish Surface Engineering   (Ireland)

^c LUBLIN UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

CONTROLLED POLYMERIZATION; CORONA PLASMAS; ELECTRICAL CHARACTERIZATION; FTIR; FUNCTIONAL COATING; GAS STATE; HELIUM PLASMAS; LONG CHAINS; LOW SPECIFIC ENERGY; NONTHERMAL EQUILIBRIUM; PERFLUOROCARBONS; PLASMA REGION; POLYMERIC COATINGS; PRECURSOR MONOMER; SI WAFER; VINYL GROUP; XPS;

ANGLE MEASUREMENT; ATMOSPHERIC CHEMISTRY; ATMOSPHERIC PRESSURE; CONTACT ANGLE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; FUNCTIONAL POLYMERS; HELIUM; JETS; MONOMERS; PLASMA DEPOSITION; PLASMA POLYMERIZATION; PLASMAS; PLASTIC COATINGS; POLYMERS; PROTECTIVE COATINGS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

ELECTRIC DISCHARGES;

EID: 70350238181     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm900816e     Document Type: Article

References (38)

1. Mattox, D. M. Mattox, V. H. 50 Years of Vacuum Coating Technology and the Growth of the Society of Vacuum Coaters; Society of Vacuum Coaters: Albuquerque, NM, 2007.
2. Shyong Siow, K.; Britcher, L.; Kumar, S.; Griesser, H. J. Plasma Process. Polym. 2006, 3, 392.
3. Tsai, Y. M.; Boerio, F. J.; van Ooij, W. J.; Kim, D. K.; Rau, T. Surf. Interface Anal. 1995, 23, 261.
4. Kumar, D. S.; Yoshida, Y. Surf. Coat. Technol. 2003, 169-170, 600.
5. Shishoo, R. Plasma Technologies for Textiles;Woodhead Publishing Ltd.: Cambridge, U.K., 2007.
6. Yasuda, H. Journal of Polymer Science: Macromolecule Reviews 1981, 16, 199.
7. Wrobel, A. M.; Walkiewicz-Pietzykowska, A.; Klemberg-Sapieha, J. E.; Nakanishi, Y. A.; Aoki, T.; Hatanaka, Y. Chem. Mater. 2003, 15, 1749.
8. Suhr, H. Plasma Chem. Plasma Process. 1983, 3, 1.
9. Forch, R.; Zhang, Z.; Knoll, W. Plasma Process. Polym. 2005, 2, 351.
10. Yoshimura, K.; Hozumi, K. J. Photopolym. Sci. Technol. 1996, 9, 225.
11. Lopez, G.; Ratner, B. D. ACS Polym. Mater. Sci. Eng. 1990, 62, 14.
12. Krishnamurthy, V.; Kamel, I. L.; Mei, Y. J. Polym. Sci., Part A: Polym. Chem. 1989, 27, 1211.
13. Ryan, M. E.; Hynes, A. M.; Badyal, J. P. S. Chem. Mater. 1996, 8, 37.
14. Schiller, S.;Hu, J.; Jenkins,A.T.A.; Timmons,R.B.; Sanchez-Estrada, F. S.; Knoll,W.; Forch,R. Chem.Mater. 2002, 14, 235.
15. Grill, A. Cold Plasmas in Material Fabrication; IEEE Press: New York, 1994.
16. Wrobel, A. M.; Walkiewicz-Pietzykowska, A.; Hatanaka, Y.; Wickramayaka, S.; Nakanishi, Y. Chem. Mater. 2001, 13, 1884.
17. Guerin, D. C.; Hinshelwood, D. D.; Monolache, S.; Denes, F. S.; Shamamian, V. A. Langmuir 2002, 18, 4118.
18. Beck, A. J.; Candan, S.; Short, R. D.; Goodyear, A.; Braithwaite, N. S. J. J. Phys. Chem. B 2001, 105, 5730.
19. Ward, L. J.; Schofield, W. C. E.; Badyal, J. P. S.; Goodwin, A. J.; Merlin, P. J. Chem. Mater. 2003, 15, 1466.
20. Ward, L. J.; Schofield, W. C. E.; Badyal, J. P. S.; Goodwin, A. J.; Merlin, P. J. Langmuir 2003, 19, 2110.
21. O'Hare, L.-A.; O'Neill, L.; Goodwin, A. J. Surf. Interface Anal. 2006, 38, 1519.
22. Albaugh, J. D.; O'Sullivan, C.; O'Neill, L. Surf. Coat. Technol. 2008, 203, 844.
23. Massines, F.; Gouda, G. J. Phys. D: Appl. Phys 1998, 31, 3411.
24. Twomey, B.; Dowling, D.; O'Neill, L.; O'Hare, L.-A. Plasma Process. Polym. 2007, 4, S450.
25. Heyse, P.; Dams, R.; Paulussen, S.; Houthoofd, K.; Janssen, K.; Jacobs, P. A.; Sels, B. F. Plasma Process. Polym. 2007, 2, 145.
26. Tatoulian, M.; Arefi-Khonsari, F. Plasma Process. Polym. 2007, 4, 360.
27. Beck, A. J.; Short, R. D.; Matthews, A. Surf. Coat. Technol. 2008, 203(5-7), 822-825.
28. Coulson, S. R.; Woodward, I. S.; Badyal, J. P. S.; Brewer, S. A.; Willis, C. Chem. Mater. 2000, 12, 2031.
29. O'Neill, L.; O'Sullivan, C. Chem Vap. Deposition 2009, 1-3, 21.
30. Barz, J.; Haupt, M.; Pusch, K.; Weimer, M.; Oehr, C. Plasma Process. Polym. 2006, 3, 540.
31. Gengenbach, T. R.; Griesser, H. J. Surf. Interface Anal. 1998, 26, 498.
32. Owens, D. K.; Wendt, R. C. J. Appl. Polym. Sci. 1969, 13, 1741.
33. Janca, J.; Klima, M.; Slavicek, P.; Zajickova, L. Surf. Coat. Technol. 1999, 116-119, 547.
34. Kapicka, V. ; Sicha, M.; Klima, M.; Brablec, A.; Biederman, H.; Slavinska, D.; Trchova M.; Behnke, J. F. Proceedings of Hakone VII International Symposium on High Pressure, Low Temperature Plasma Chemistry; Greifswald, Germany, Sept 10-13, 2000; pp 506-508
35. Warburg, E. Jahrb. Radioakt. 1909, 6, 181.
36. Becker, H. Wiss. Veroeff. SIEMENS-Konzern 1920, 1, 76.
37. Rutscher, A.; Wagner, H.-E. Plasma Sources Sci. Technol. 1993, 2, 279-288.
38. Hegemann, D.; Hossain, M. M.; Korner, E.; Balazs, D. J. Plasma Process. Polym. 2007, 4, 229.