Recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging

Microelectronics International

Volumn 24, Issue 3, 2007, Pages 18-26

  Zhong, Z W ^a   Tee, T Y ^b   Luan, J E ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b AMKOR TECHNOLOGY   (Singapore)

^c STMICROELECTRONICS   (Singapore)

Author keywords

Joining process; Soldering; Wires

Indexed keywords

COMPLEX APPLICATIONS; COPPER WIRES; DESIGN/METHODOLOGY/APPROACH; FLIP CHIP; JOINING PROCESS; JOURNAL PAPER; LEAD FREE SOLDERS; LEAD-FREE SOLDER JOINT; MICROELECTRONICS PACKAGING; PAGE LIMITATION; RESEARCH LIMITATIONS; WIRE BONDING;

CHIP SCALE PACKAGES; COPPER COMPOUNDS; DESIGN; MICROELECTRONICS; PACKAGING; RESEARCH; WIRE;

SOLDERING;

EID: 79958772766     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360710779154     Document Type: Review

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