Modern IC packaging trends and their reliability implications

Microelectronics Reliability

Volumn 46, Issue 9-11, 2006, Pages 1868-1873

  Plieninger, R ^a   Dittes, M ^a   Pressel, K ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT LAYOUT; LEAD; MINIATURE INSTRUMENTS; OPTIMIZATION; RELIABILITY;

LEADLESS PACKAGES; MINIATURIZATION; MOBILE DEVICES; PACKAGING TECHNOLOGIES;

ELECTRONICS PACKAGING;

EID: 33747750870     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.08.008     Document Type: Article

References (9)

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3. Ebersberger B, Bauer R, Alexa L. Qualification of SnAg Solder Bumps for Lead-Free Flip Chip Application. 54th Electronics Component Technology Conference ECTC 2004, Las Vegas, NV, p. 683-91.
4. Birzer C, Rakow B, Steiner R, Walter J. Drop Test Reliability Improvement of Lead-Free Fine Pitch BGA Using Different Solder Ball Composition", Electronics Packaging Technology Conference 7th EPTC 2005, Singapore, p. 255-61.
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9. Dittes M, Oberndorff P, Petit L. Tin Whisker Formation Results, Test Methods and Countermeasures. Proceedings 53rd Electronics Components & Technology Conference, 2003, p. 822-6.