Wire-bonding process development for low-k materials

Microelectronic Engineering

Volumn 81, Issue 1, 2005, Pages 75-82

  Tan, Jonathan ^a   Zhong, Zhao Wei ^b   Ho, Hong Meng ^a  

^a Kulicke and Soffa Pte Ltd   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Aluminium pad; Gold wire; Hardness; Low k material; Pad damage; Wire bond

Indexed keywords

ALGORITHMS; ALUMINUM; GOLD; HARDNESS; INTEGRATED CIRCUITS; MICROELECTRONICS;

ALUMINUM PADS; GOLD WIRES; LOW-K MATERIALS; PAD DAMAGE; WIRE BOND;

DIELECTRIC MATERIALS;

EID: 21644440359     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.03.061     Document Type: Article

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