SCOPUS 정보 검색 플랫폼

Volumn 29, Issue 3-4, 2006, Pages 372-378

Surface integrity of silicon wafers in ultra precision machining

Author keywords

Grinding; Lapping; Silicon wafer; Subsurface damage; Total thickness variation

Indexed keywords

INDUSTRIAL ENGINEERING; INTEGRATED CIRCUITS; LAPPING; SINGLE CRYSTALS; SURFACE ROUGHNESS; THICKNESS MEASUREMENT;

MICRO-ROUGHNESS; SUBSURFACE DAMAGE; SURFACE GRINDING; TOTAL THICKNESS VARIATION;

SILICON WAFERS;

EID: 33744535194 PISSN: 02683768 EISSN: 14333015 Source Type: Journal
DOI: 10.1007/s00170-005-2508-1 Document Type: Article

Times cited : (72)

References (10)

1
- 0033157004
- Grinding induced subsurface cracks in silicon wafers
- Pei ZJ, Billingsley SR, Miura, S (1999) Grinding induced subsurface cracks in silicon wafers. Int J Mach Tools Manuf 39:1103-1116
- (1999) Int J Mach Tools Manuf , vol.39 , pp. 1103-1116
- Pei, Z.J.¹ Billingsley, S.R.² Miura, S.³

2
- 0042659617
- Ductile or partial ductile mode machining of brittle materials
- Zhong ZW (2003) Ductile or partial ductile mode machining of brittle materials. Int J Adv Manuf Technol 21:579-585
- (2003) Int J Adv Manuf Technol , vol.21 , pp. 579-585
- Zhong, Z.W.¹

3
- 0004237664
- EllisHorwood, Chichester, UK
- Atkins AG, Mai YW (1985) Elastic and plastic fracture. EllisHorwood, Chichester, UK
- (1985) Elastic and Plastic Fracture
- Atkins, A.G.¹ Mai, Y.W.²

4
- 0040508101
- World Scientific, Singapore
- Zhang LC, Yasunaga, N (1997) Advances in abrasive technology. World Scientific, Singapore
- (1997) Advances in Abrasive Technology
- Zhang, L.C.¹ Yasunaga, N.²

5
- 0030565064
- Laterally resolved crystalline damage in single-point-diamond-turned silicon
- Jeynes C, Puttick KE, Whitmore LC, Gartner K, Gee AE, Millen DK, Webb RP. Peel RMA, Sealy BJ (1996) Laterally resolved crystalline damage in single-point-diamond-turned silicon. Nucl Instrum Metliods Phys Res B 40:431-436
- (1996) Nucl Instrum Metliods Phys Res B , vol.40 , pp. 431-436
- Jeynes, C.¹ Puttick, K.E.² Whitmore, L.C.³ Gartner, K.⁴ Gee, A.E.⁵ Millen, D.K.⁶ Webb, R.P.⁷ Rma, P.⁸ Sealy, B.J.⁹

6
- 0034236074
- Micro-raman spectral analysis of the subsurface damage layer in machined silicon wafers
- Chen LQ, Zhang X, Zhang TY (2000) Micro-raman spectral analysis of the subsurface damage layer in machined silicon wafers. J Mater Res 15(7):1441-1444
- (2000) J Mater Res , vol.15 , Issue.7 , pp. 1441-1444
- Chen, L.Q.¹ Zhang, X.² Zhang, T.Y.³

7
- 0026170699
- Fractal fracture of single crystal silicon
- Tsai YL, Mecholsky JJ Jr (1991) Fractal fracture of single crystal silicon. J Mater Res 6(6): 1248-1263
- (1991) J Mater Res , vol.6 , Issue.6 , pp. 1248-1263
- Tsai, Y.L.¹ Mecholsky Jr., J.J.²

8
- 0018542425
- On the scribing and subsequent fracturing of silicon semiconductor wafers
- Misra A, Finnie I (1979) On the scribing and subsequent fracturing of silicon semiconductor wafers. J Mater Sci 14:2567-2574
- (1979) J Mater Sci , vol.14 , pp. 2567-2574
- Misra, A.¹ Finnie, I.²

9
- 0034223813
- Analysis of the grain depth of cut in plunge grinding
- Sharp KW, Miller MH, Scattergood RO (2000) Analysis of the grain depth of cut in plunge grinding. J Int Soc Precis Eng Nanotechnol 24:220-230
- (2000) J Int Soc Precis Eng Nanotechnol , vol.24 , pp. 220-230
- Sharp, K.W.¹ Miller, M.H.² Scattergood, R.O.³

10
- 33744521461
- Masters thesis, National Tsing Hua University
- Lin CP (2002) A study on the characteristics of the surface profile of the ground wafer. Masters thesis, National Tsing Hua University
- (2002) A Study on the Characteristics of the Surface Profile of the Ground Wafer
- Lin, C.P.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.