Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications

Soldering and Surface Mount Technology

Volumn 17, Issue 1, 2005, Pages 24-32

  Jackson, G J ^a,b   Hendriksen, M W ^c   Kay, R W ^d   Desmulliez, M ^e   Durairaj, R K ^b   Ekere, N N ^b  

^a Hakel Technologies   (United Kingdom)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

^c Celestica   (United Kingdom)

^d Microstencil Ltd   (United Kingdom)

^e HERIOT WATT UNIVERSITY   (United Kingdom)

Author keywords

Integrated circuit technology; Printed circuits; Solder

Indexed keywords

COST EFFECTIVENESS; ELECTRONIC EQUIPMENT; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; PRINTED CIRCUITS; RHEOLOGY; TRANSISTORS;

INTEGRATED CIRCUIT TECHNOLOGY; ORIGINAL ELECTRONIC MANUFACTURERS (OEM); PARTICLE PACKING; SOLDER PASTE RHEOLOGY;

SOLDERING ALLOYS;

EID: 18844366438     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510579212     Document Type: Conference Paper

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