Determination of Packaging Material Properties Utilizing Image Correlation Techniques

Journal of Electronic Packaging

Volumn 124, Issue 4, 2002, Pages 345-351

  Vogel, D ^a   Kuhnert R ^b   Dost, M ^c   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

^b Image Instruments GmbH   (Germany)

^c Chemnitzer Werkstoffmechanik GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 19044380284     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1506698     Document Type: Article

References (13)

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2. Willecke, R., and Ho, P. S., 1997, "Study of Vertical Thermo-Mechanical Properties of Polyimide Thin Films," Proc. of Micro Materials '97, April 16-18, Berlin, pp. 721-724.
3. Vogel, D., et al., 1997, "Deformation Analysis on Flip Chip Solder Interconnects by MicroDAC," Proc. of Reliability of Solders and Solder Joints Symposium at 126th TMS Annual Meeting & Exhibition, February 9- 13, Orlando, FL, TMS Pub. Cat. No. 96-80433, pp. 429-443.
4. Vogel, D., Schubert, A., Faust, W., Dudek, R., and Michel, B., 1996, "MicroDAC - A Novel Approach to Measure In Situ Deformation Fields of Microscopic Scale," Microelectron. Reliab., 36(11/12), pp. 1339-1342.
5. Vogel, D., Luczak, F, Wittier, O., Gollhardt, A., Walter, H., and Michel, B., 2000, "Measurement of Material Properties by a Modified MicroDAC Approach," Proc. of Micro Materials 2000, Berlin Germany.
6. Wittler, O., Sprafke, P., Walter, H., Gollhardt, A., Vogel, D., and Michel, B., 2000, "Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications," Materials Week 2000, September 25-28, Munich, Germany.
7. Vogel, D., Kühnert, R., and Michel, B., 1999, "Strain Measurement in Micrometrology," Int. Symp. on Photonics and Applications at the ISPA '99, Singapore, Proc. of SPIE, Vol. 3897, pp. 224-238.
8. Lu, Y. G., Zhong, Z. W., Yu, J., Xie, H. M., Ngoi, B. K. A., Chai, G. B., and Asundi, A., 2001, "Thermal deformation measurement of electronic packages using the atomic force microscope scanning moire technique," Rev. Sci. Instrum., 72, No. 4, pp. 2180-2185.
9. Wiese, S., Rossek, U., Feustel, F., and Meusel, E., 1997, "Image Processing Analysis in Micropackaging," Proc. of "Micro Materials '97," April 16-18, Berlin, Germany, pp. 237-240.
10. Lu, H.: 1998, "Application of digital speckle correlation to microscopic strain measurement and material's property characterization," ASME J. Electron. Packag., 120 September, pp. 275-279.
11. Anwander, M., Weiss, B., Zagar, Z., and Weiss, H., 1996, A laser speckle correlation method for strain measurements at elevated temperatures, Proc. the Symp. "Local Strain and Temperature Measurements in Non-Uniform Fields at Elevated Temperatures," March 14-15, Berlin, Germany, pp. 49-58.
12. German patent 10023752.5-52
13. Vogel, D. and Michel, B., 2001, "Microcrack evaluation for electronics components by AFM nanoDAC deformation measurement," Proc. of "IEEE-NANO 2001," October 28-30, Maui, HI, pp. 309-312.