A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 487-495

  Jang, Changsoo ^a   Han, Seongyoung ^a   Kim, Hangyu ^a   Kang, Sayoon ^b  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FAILURE ANALYSIS; FILM GROWTH; FINITE ELEMENT METHOD; LIQUID CRYSTAL DISPLAYS; NUMERICAL ANALYSIS;

CHIP/FILM ASSEMBLY PROCESS; FLIP CHIP-ON-FLEX; LCD PACKAGES; TAPE CARRIER PACKAGES;

FLIP CHIP DEVICES;

EID: 30844438941     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.06.013     Document Type: Article

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