Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique

International Journal of Advanced Manufacturing Technology

Volumn 27, Issue 7-8, 2006, Pages 708-714

  Zhong, Z W ^a   Wong, K W ^a   Shi, X Q ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Crack; Creep; Deformation; Flip chip; Real time Moir ; Shear strain; Strain energy release rate; Stress intensity factors; Thermal testing

Indexed keywords

CRACKS; CREEP; INTERFACES (MATERIALS); PLASTIC DEFORMATION; SILICON; STRAIN; STRESS INTENSITY FACTORS;

CRACK TIPS; REAL-TIME MOIRÉ; STRAIN ENERGY RELEASE RATE; THERMAL TESTING;

FLIP CHIP DEVICES;

EID: 29344462769     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-004-2245-x     Document Type: Article

References (33)

1. Zhong ZW, Tok WH (2003) Grinding of single-crystal silicon along crystallographic directions. Mater Manuf Process 18(5)811-824
2. Lau JH (1996) Flip chip technologies. McGraw-Hill, New York
3. Zhong ZW (2001) Development of a reliable packaging process for flip chip on ceramics. Microelectron Int 18(1)19-22
4. Zhong ZW (2001) Flip chip assemblies using gold bumps and adhesive. Microelectron Int 18(3)15-19
5. Zhong ZW (2001) Reliability of flip chips on FR-4 assembled with reduced process steps. Circuit World 27(3):26-30
6. Zhong ZW (2001) Stud bump bond packaging with reduced process steps. Solder Surf Mount Technol 13(2):35-38
7. Kuhl A, Qu JM (2000) A technique to measure interfacial toughness over a range of phase angles. J Electron Packag 122:147-151
8. Lau JH (2000) Low cost flip chip technologies for DCA, WLCSP and PBGA assemblies. McGraw-Hill, New York
9. Zhong ZW (1999) Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill. Microelectron Int 16(3):6-14
10. Zhong ZW (2001) Reliability of FCOB with and without encapsulation. Solder Surf Mount Technol 13(2):21-25
11. Lau JH, Lee SWR, Chang C (2000) Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants. IEEE Trans Compon Packag Technol ogies 23(2):323-332
12. Darveaux R. Mawer A (1995) Thermal and power cycling limits of plastic ball grid array (PBGA). In: Proceedings of Surface Mount International, 1995, pp 315-325
13. Darveaux R, Baneji K, Mawer A, Doddoy G (1994) Reliability of ball grid array solder joints. In: Lau JH, ed. Ball grid array technology. McGraw-Hill, New York
14. Syed A (1997) A review of finite element methods for solder joint analysis. E/NMEP 1
15. Zhong ZW, Yip PK (2003) Finite element analysis of a three dimensional package. Solder Surf Mount Technol 15(1):21-25
16. Han B, Guo Y (1995) Thermal deformation analysis of various electronic packaging products by Moiré and microscopic Moiré interferometry. J Electron Packag 117:185-191
17. Lau JH (1993) Thermal stress and strain in microelectronics packaging. Van Nostrand, New York
18. Guo Y, Liu S (1998) Development in optical methods for reliability analysis in electronic packaging applications. J Electron Packag 120:186-193
19. B Han, D Post (1992) Immersion interferometer for microscopic Moiré interferometry. Exp Mech 31(1):38-41
20. Zhong ZW, Lim SC, Asundi AK, Chai TC (2001) Micro Moiré for thermal deformation investigation in electronics packaging. In: Proceedings of SPIE 4596:256-260
21. Lu YG, Zhong ZW, Yu J, Xie HM, Ngoi BKA, Chai JB, Asundi A (2001) Thermal deformation measurement of electronic packages using atomic force microscope scanning Moiré technique. Rev Sci Instrum 72(4):2180-2185
22. Xie HM, Asundi A, Chai GB, Lu YG, Yu J, Zhong ZW, Ngoi BKA (2002) High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package. Microelectron Reliab 42:1219-1227
23. Zhong ZW, Lu YG (2003) An AFM scanning Moiré technique for inspection of surface deformations. Int J Adv Manuf Technol 23(5-6):462-466
24. Zhong ZW, Nah SK (2003) Thermal strain analysis of an electronics package using the SEM Moiré technique. Solder Surf Mount Technol 15(3):33-35
25. Zhong ZW, Shi XQ, Wong KW, Wang ZP (2002) Flip chip interfacial behavior under thermal testing. In: Proceedings of 4th Electronics Packaging Technology Conference, Singapore, 2002, pp 56-59
26. Post D, Han B, Ifju P (1993) High sensitivity Moiré: experimental analysis for mechanics and materials. Springer, Berlin Heidelberg New York
27. Zhang W, Wu D, Su B, Hareb SA, Lee YC, Materson BP (1998) The effect of underfill epoxy on warpage in flip chip assemblies. IEEE Trans Compon Packag Manuf Technol 21(2):323-328
28. Hanna CE, Sitaraman SK (1999) Role of underfill materials and thermal cycling on die stresses. Adv Electron Packag 26(1):795-801
29. Miller MR, Mohammed I, Ho PS (2001) Quantitative strain analysis of flip chip electronic packages using phase-shifting Moiré interferometry. Opt Lasers Eng 36:127-139
30. Hutchinson JW, Suo Z (1992) Mixed mode cracking in layered materials. Adv Appl Mech 29:64-187
31. Lau JH, Lee SWR (2000) Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills. J Electron Packag 122:306-310
32. Rice JR (1988) Elastic fracture mechanics concepts for interfacial cracks. J Appl Mech 55:98-103
33. Malyshev BM, Salganik RL (1965) The strength of adhesive joints using the theory of cracks. Int J Fract Mech 1:114-128