Effect of substrate metallization on mechanical properties of Sn-3.5Ag BGA solder joints with multiple reflows

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 569-574

  Koo, Ja Myeong ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Intermetallic compound; Lead free; Metallization; Shear test; Tin silver (Sn Ag) solder

Indexed keywords

INTERMETALLICS; MECHANICAL PROPERTIES; METALLIZING; REACTION KINETICS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS;

LEAD-FREE; SHEAR TEST; SN-AG SOLDER;

TIN COMPOUNDS;

EID: 28044468188     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.07.057     Document Type: Conference Paper

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