Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

Microelectronics International

Volumn 16, Issue 3, 1999, Pages 6-14

  Zhong, Zhaowei ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Anisotropy; Eutectic solder; Flip chip; Reliability; Underfill

Indexed keywords

EID: 0013460150     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565369910293297     Document Type: Article

References (13)

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