Reliability of FCOB with and without encapsulation

Soldering and Surface Mount Technology

Volumn 13, Issue 2, 2001, Pages 21-25

  Zhong, Z ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Encapsulation; Eutectic solder; Flip chip; Reliability

Indexed keywords

CERAMIC MATERIALS; ENCAPSULATION; EUTECTICS; HIGH TEMPERATURE TESTING; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS; THERMAL CYCLING; TIN ALLOYS;

FLIP CHIP ON BOARD (FCOB) ASSEMBLIES;

FLIP CHIP DEVICES;

EID: 0034991303     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910110385211     Document Type: Article

References (7)

1. Optimizing the reflow profile via defect mechanism analysis
2. Reliability of flip chip components soldered on FR5 board
3. The beneficial effect of underfilling on the reliability of flip-chip joints
4. Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package