Application of virtual crack closure integral method for interface cracks in low-k integrated circuit devices under thermal load

Engineering Fracture Mechanics

Volumn 72, Issue 9, 2005, Pages 1361-1382

  Zhao, Jie Hua ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Energy release rate; Finite element method; Interfacial fracture; Mode mixity; Stress intensity factor; Sub modeling; Thermal crack; Virtual crack closure integral

Indexed keywords

CRACKS; DELAMINATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; PLATES (STRUCTURAL COMPONENTS); STRESS INTENSITY FACTORS;

ENERGY RELEASE RATE (ERR); INTERFACE CRACKS; THERMAL LOADS; VIRTUAL CRACK CLOSURE INTEGRAL (VCCI);

INTERFACES (MATERIALS);

FRACTURE MECHANICS;

EID: 13944253708     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2004.10.007     Document Type: Article

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