Study of under bump metallisation barrier layer for lead-free solder

Soldering and Surface Mount Technology

Volumn 15, Issue 2, 2003, Pages 46-52

  Chan, K C ^a   Zhong, Z W ^b   Ong, K W ^b  

^a MicroFab Technology (S) Pte Ltd   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Lead free; Under bump metallurgy

Indexed keywords

COPPER; ELECTROPLATING; LEAD; METALLIZING; NICKEL; RELIABILITY;

BUMP METALLIZATION;

SOLDERING ALLOYS;

EID: 0037591574     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310479521     Document Type: Article

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