High performance anisotropic conductive adhesives for lead-free interconnects

Soldering and Surface Mount Technology

Volumn 18, Issue 2, 2006, Pages 33-39

  Li, Yi ^a   Wong, C P ^a,b,c,d,e  

^a Georgia Institute of Technology   (United States)

^b LUCENT TECHNOLOGIES   (United States)

^c Center for Organic Photonics and Electronics   (United States)

^d GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^e NATIONAL ACADEMY OF ENGINEERING   (United States)

Author keywords

Adhesives; Electronic engineering; Joining materials; Thermal stability

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES (ACAS); JOINING MATERIALS; OCTADECANETHIOL (ODT); SUBSTRATE BOND PAD;

ANISOTROPY; ELECTRIC PROPERTIES; INTERFACES (MATERIALS); SELF ASSEMBLY; SOLDERED JOINTS; THERMODYNAMIC STABILITY;

ADHESIVES;

EID: 33646375211     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910610665116     Document Type: Article

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