High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package

Microelectronics Reliability

Volumn 42, Issue 8, 2002, Pages 1219-1227

  Xie, Huimin ^a,c   Asundi, Anand ^b   Boay, Chai Gin ^b   Yunguang, Lu ^b   Yu, Jin ^b   Zhaowei, Zhong ^b   Ngoi, Bryan K A ^b  

^a TSINGHUA UNIVERSITY   (China)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c BEIJING INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; DEFORMATION; ELECTRON BEAMS; INTERFEROMETRY; SOLDERING ALLOYS; STRAIN; THERMAL EFFECTS;

BALL GRID ARRAYS (BGA);

ELECTRONICS PACKAGING;

EID: 0036681733     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00084-7     Document Type: Article

References (11)

1. Deformation measurement during powder compaction by a scanning Moiré method
2. Theory of electron beam Moiré
3. Thermal deformation measurement of the solder joints in electronic package using electron Moiré method
4. Thermal deformation measurement of electronic package using advanced Moiré methods
5. In-plane deformation measurement using the atomic force microscope Moiré method
6. Moiré in atomic force microscope
7. Thermal deformation measurement of electronic packages using the atomic force microscope scanning Moiré technique
8. Moiré methods of strain analysis