Study of factors affecting the hardness of ball bonds in copper wire bonding

Microelectronic Engineering

Volumn 84, Issue 2, 2007, Pages 368-374

  Zhong, Z W ^a   Ho, H M ^b   Tan, Y C ^c   Tan, W C ^a   Goh, H M ^b   Toh, B H ^c   Tan, J ^d  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b Kulicke and Soffa SEA Pte Ltd   (Singapore)

^c Kulicke and Soffa Pte Ltd   (Singapore)

^d INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

Copper wire bonding; Electro flame off; Free air ball; Microhardness

Indexed keywords

BONDING; COPPER; ELECTRIC CURRENTS; MICROHARDNESS;

COPPER WIRE BONDING; ELECTRO-FLAME-OFF; FREE AIR BALL;

ELECTRIC WIRE;

EID: 33846307426     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.11.003     Document Type: Article

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