Thermal analysis of a silicon wafer processing combination bake-chill station used in microlithography

Materials and Manufacturing Processes

Volumn 20, Issue 2, 2005, Pages 273-286

  Narasimhan, Arunn ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

Author keywords

300 mm resist processing; Bake plate; Chemically amplified resist; Chill plate; Combination bake chill; Numerical simulation; Proximity bake; Thermal analysis; Throughput

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ETCHING; MICROELECTROMECHANICAL DEVICES; PHOTOLITHOGRAPHY; THERMOANALYSIS; THROUGHPUT;

300-MM RESIST PROCESSING; BAKE PLATE; CHEMICALLY AMPLIFIED RESIST; CHILL PLATE; COMBINATION BAKE CHILL; PROXIMITY BAKE;

SILICON WAFERS;

EID: 16644400479     PISSN: 10426914     EISSN: None     Source Type: Journal    
DOI: 10.1081/AMP-200042048     Document Type: Review

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