Evaluation of board-level reliability of electronic packages under consecutive drops

Microelectronics Reliability

Volumn 46, Issue 7, 2006, Pages 1172-1182

  Yeh, Chang Lin ^a   Lai, Yi Shao ^a   Kao, Chin Li ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; MICROPROCESSOR CHIPS; RELIABILITY; SOLDERED JOINTS;

BOARD-LEVEL RELIABILITY; DAMAGE FACTORS; PLASTIC STRAIN ENERGY DENSITIES;

ELECTRONIC EQUIPMENT;

EID: 33646488627     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.09.002     Document Type: Article

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