Assembly and reliability of PBGA packages on FR-4 PCBs with SnAgCu solder

Microelectronic Engineering

Volumn 83, Issue 11-12, 2006, Pages 2462-2468

  Arulvanan, P ^a   Zhong, Z W ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Joint dimensions; Microstructure; Reliability; SnAgCu solder joints; Thermal cycling

Indexed keywords

INTERMETALLICS; MICROELECTRONICS; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; THERMAL CYCLING;

JOINT DIMENSIONS; PLASTIC BALL GRID ARRAY (PBGA); SNAGCU SOLDER JOINTS; THERMAL CYCLES;

ELECTRONICS PACKAGING;

EID: 33751213416     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.05.002     Document Type: Article

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