Characterisation of electroplated Sn/Ag solder bumps

Microelectronics Journal

Volumn 37, Issue 4, 2006, Pages 308-316

  Bigas, M ^a   Cabruja, E ^a  

^a UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

Author keywords

AES; Bumping; EDS; Fine pitch; Flip chip; Sn Ag

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CHARACTERIZATION; ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; TERNARY SYSTEMS;

AES; BUMPING; FINE PITCH; FLIP CHIP; SN/AG;

SOLDERING ALLOYS;

EID: 32544454315     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2005.05.017     Document Type: Article

References (20)

1. Z.S. Karim, R. Schetty, Lead-free bump interconnections for flip-chip applications, in: IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2000, pp. 274-278.
2. P. Wölflick, K. Feldmann. Lead-free low-cost flip chip process chain: layout, process, reliability, in: IEEE International Electronics Manufacturing Technology (IEMT) Symposium, 2002, pp. 27-34.
3. M. McCormack, S. Jin. The design and properties of new, pb-free solder alloys, in: IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1994, pp. 7-14.
4. T. Laine-Ylijoki, H. Steen, and A. Forsten Development and validation of a lead-free alloy for solder paste applications IEEE Transactions on Components, Packaging, and Manufacturing Technology 20 3 1997 194 198
5. D. Frear, J. Jang, J. Lin, and C. Zhang Pb-free solders for flip-chip interconnects JOM 53 6 2001 28 32
6. M. Bigas, and E. Cabruja Electrodeposited Sn/Ag for flip chip connection CDE Feb 2003
7. S.-Y. Jang, J. Wolf, O. Ehrmann, H. Gloor, H. Reichl, and P. Kyung-Wook Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (ubm) IEEE Transactions on Electronics Packaging Manufacturing 25 4 2002 193 202
8. H. Ezawa, M. Miyata, S. Honma, H. Inoue, T. Tokuoka, J. Yoshioka, and M. Tsujimura Eutectic Sn-Ag solder bump process for ulsi flip chip technology IEEE Transactions on Electronics Packaging Manufacturing 24 4 2001 275 281
9. L.S. Pei-Siang, L.C. Khoon, L. Charles, T. Poi-Siong. High density fine pitch Pb-free flip chip interconnect assembly, in: Conference on Electronics Packaging Technology, 2003, pp. 275-281.
10. D. Shangguan, A. Achari. Evaluation of lead-free eutectic Sn-Ag solder for automotive electronics packaging applications, in: IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1994, pp. 25-37.
11. S. Choi, J. Lucas, K. Subramanian, and T. Bieler Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints 2000 Kluver Dordrecht pp. 497-502
12. R. Kiumi, J. Yoshioka, F. Kuriyama, N. Saito, M. Shimoyama. Process development of electroplate bumping for ulsi flip chip technology, in: Conference on Electronic Components and Technology, 2002, pp. 711-716.
13. B. Kim, T. Ritzdorf. Electrodeposition of ternary near-eutectic SnAgCu solders with an alkaline bath, in: International Symposium on Advanced Packaging Materials, 2002, pp. 54-60.
14. G.J. Chou. Microstructure evolution of SnPb and SnAg/Cu BGa solder joints during thermal aging, in: International Symposium on Advanced Packaging Materials, 2002, pp. 39-46.
15. J.H. Glezen, H. Naseem, I. Fritsch, R. Ulrich, W. Brown, L. Schaper. Flip chip interconnects with electroplated, extended eutectic solder, in: International Conference on Multichip Modules and High Density Packaging, 1998, pp. 319-323.
16. L. Kwang-Lung, and L. Yi-Cheng Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps IEEE Transactions on Advanced Packaging 22 4 1999 568 574
17. K.D. Childs, B.A. Carlson, L.A. LaVanier, J.F. Moulder, D.F. Paul, W.F. Sticke, D.G. Watson. Handbook of auger electron Spectroscopy. Physical Electronics, Inc. 1995.
18. L. Li, R. Yang, L. Jong-Kai. Pb-free solder paste reflow window study for flip chip wafer bumping, in: International Symposium on Advanced Packaging Materials, Mar 2001, pp. 112-118.
19. H.D. Blair, T.-Y. Pan, J.M. Nicholson. Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sb/Ag and Sn solders, in: Conference on Electronic Components and Technology, 1998, pp. 259-267.
20. G. Jackson, M. Hendriksen, R. Horsley, N. Hoo, B. Salam, N. Ekere. Establishing control factors of intermetallic formation within Pb-free solder bumps at flip chip geometries, in: Conference on Electronic Components and Technology, 2003, pp. 1472-1479.