Chip packaging challenges ... a roadmap based overview

Microelectronics International

Volumn 22, Issue 2, 2005, Pages 17-20

  Longford, Andy ^a  

^a P and A Europe   (United Kingdom)

Author keywords

Electronics industry; Semiconductor technology

Indexed keywords

EID: 18144368924     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360510592180     Document Type: Article

References (3)