The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints

Soldering and Surface Mount Technology

Volumn 18, Issue 4, 2006, Pages 28-37

  Frisk, Laura ^a   Kokko, Kati ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Adhesives; Joining materials; Reliability management; Substrates

Indexed keywords

ADHESIVES; FLIP CHIP DEVICES; RELIABILITY; SUBSTRATES; THERMAL CYCLING;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); BONDING PRESSURES; RELIABILITY MANAGEMENT;

MICROPROCESSOR CHIPS;

EID: 33751173192     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910610717884     Document Type: Article

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