Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept

Microelectronics Reliability

Volumn 47, Issue 2-3, 2007, Pages 187-195

  Roellig, Mike ^a   Dudek, Rainer ^b   Wiese, Steffen ^a   Boehme, Bjoern ^a   Wunderle, Berhard ^b   Wolter, Klaus Juergen ^a   Michel, Bernd ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE LAWS; TEMPERATURE GRADIENTS; TEMPERATURE PROFILE; THERMO-MECHANICAL LOADS;

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; LEAD; TEMPERATURE DISTRIBUTION; THICK FILMS; THIN FILMS;

SOLDERED JOINTS;

EID: 33846618293     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.09.013     Document Type: Article

References (6)

1. Wiese S, Schubert A, et al. Constitutive behaviour of lead-free solders v. lead containing solders - experiments on bulk specimen and flip-chip joints, Electronic Component and Technology Conference 2001.
2. Miller, and Chris. Techniques for reducing resistance measuring uncertainty. Keithley Instruments (1998)
3. Schubert A, Dudek R, Auerswald e, Gollhardt A, Michel B, Reichl H. Fatigue life models for SnAgCu and SnPb solder joints evaluated bay experiments and simulation, In: Electronic Components and Technology Conference, 2003.
4. Spraul M, Nüchter W, Wunderle B, Michel B. FE analysis and experimental testing of a 4 pin ceramic test vehicle with tin-lead and tin-silver-copper solder joints, In: 6th. Int. Conf. on Thermal, Mechanical and Multi-physics Simulation, 2005.
5. Che F.X, John H.L. Pang. Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder joints. In: Electronic Components and Technology Conference, 2004.
6. Sung K. Kang, Won Kyoung Choi, Da-Yuan Shih, Donald W. Henderson. Formation of Ag3Sn Plates in SnAgCu alloys and optimization of their alloy composition, In: Electronic Components and Technology Conference, 2003.