Flip chip attachment on flexible LCP substrate using an ACF

Microelectronics Reliability

Volumn 45, Issue 3-4, 2005, Pages 583-588

  Frisk, L ^a   Ristolainen, E ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ATMOSPHERIC HUMIDITY; BONDING; CONDUCTIVE FILMS; LIQUID CRYSTAL POLYMERS; NICKEL; PRINTED CIRCUIT BOARDS; RESINS;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); ANISOTROPIC CONDUCTIVE FILMS (ACF); FLIP CHIP ATTACHMENT; HUMIDITY TESTS;

FLIP CHIP DEVICES;

EID: 15744397306     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.10.009     Document Type: Article

References (11)

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