Failure analysis techniques for lead-free solder joints

Soldering and Surface Mount Technology

Volumn 18, Issue 4, 2006, Pages 21-27

  Castello, Todd ^a   Rooney, Dan ^a   Shangguan, Dongkai ^a  

^a Flextronics   (United States)

Author keywords

Failure (mechanical); Joining materials; Lead; Solder

Indexed keywords

FAILURE (MECHANICAL); FAILURE ANALYSIS; LEAD; METALLOGRAPHY; MICROSCOPIC EXAMINATION; RADIOGRAPHY; RELIABILITY; STRENGTH OF MATERIALS;

JOINING MATERIALS; LEAD-FREE SOLDER; PHOTOMICROGRAPHY;

SOLDERED JOINTS;

EID: 33751170882     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910610717875     Document Type: Article

References (14)

1. ANSI (1993), ANSI/J-STD 001 Requirements for Soldered Electrical and Electronic Assemblies, Joint National Soldering Standard Test Group, EIA Soldering Technology Committee, Soldering Subcommittee of the IPC, EIA and IPC, Washington, DC.
2. Arra, M., Castello, T., Shangguan, D. and Ristolainen, E. (2004), "Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings", Soldering & Surface Mount Technology, Vol. 16 No. 1, pp. 35-43.
3. Bernard, D. (2003), "Implications of using lead-free solders on X-ray inspection of flip chips and BGAs", Proceedings of the SMTA International Conference, Chicago, IL, pp. 544-9.
4. Burnette, T. and Koschmieder, T. (2003), "Solder joint failure analysis", Advanced Packaging, available at: http://ap.pennnet.com/ articles/articledisplay.cfm?Section=ARCHI&C=Feat&ARTICLEID=165957.
5. Davis, P.E., Warwick, M.E., Kay, P.J. and Muckett, S.J. (1983), "Intermetallic compound growth and solderability", Plating and Surface Finishing, Vol. 70, pp. 49-53.
6. Dunford, S., Canumalla, S. and Viswanadham, P. (2004), "Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections", Proceedings of the 54th IEEE Electronic Components and Technology Conference, Las Vegas, pp. 726-36.
7. Geiger, D., Castello, T. and Shangguan, D. (2004), "X-ray inspection of area array packages using tin-lead and lead-free solders", Proceedings of the SMTA International Conference, Chicago, IL, pp. 553-5.
8. Gleason, J., Reynolds, C., Bath, J., Chu, Q., Kelly, M., Lyjak, K. and Roubaud, P. (2005), "Pb-free assembly, rework, and reliability analysis of IPC class 2 assemblies", Proceedings of the 55th IEEE Electronic Components and Technology Conference, Orlando, FL, pp. 959-69.
9. IPC (1988), "Microsectioning", IPC-TM-650 Test Methods Manual, 2.1.1, IPC, Arlington, VA.
10. IPC (2005), "Task group (7-31b) of the product assurance subcommittee (7-30)", IPC-A-610 Acceptability of Electronic Assemblies, IPC, Arlington, VA.
11. Kang, S.K., Lauro, P.A., Shih, D.Y., Henderson, D.W. and Puttlitz, K.J. (2005), "Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications", IBM Journal of Research & Development, Vol. 49 Nos 4/5, pp. 607-20.
12. Lau, J. (1991), Solder Joint Reliability Theory and Applications, Chapters 6-8, Van Nostrand Reinhold, New York, NY.
13. Lau, J., Shangguan, D., Castello, T., Horsley, R., Smetana, J., Dauksher, W., Love, D., Menis, I. and Sullivan, R. (2004), "HDPUG's failure analysis of high-density packages' lead-free solder joints", Soldering & Surface Mount Technology, Vol. 16 No. 2, pp. 69-76.
14. Nguyen, J., Geiger, D., Rooney, D. and Shangguan, D. (2006), "Reliability study of lead-free area array packages with tin-lead soldering process", Proceedings of the SMTA International Conference, September, Chicago, IL, pp. 433-8.