Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly

Soldering and Surface Mount Technology

Volumn 18, Issue 2, 2006, Pages 27-32

  Yin, C Y ^a   Lu, H ^a   Bailey, C ^a,c,d,e,f,g   Chan, Y C ^b,d,h  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^c IEEE

^d IEEE ^*

^e Society for Industrial and Applied Mathematics

^f Chinese academy of sciences

^g Materials Society

^h EPA Centre   (Hong Kong)

Author keywords

Electrical connections; Modelling; Moisture

Indexed keywords

ANISOTROPIC CONDUCTIVE FILM (ACF); ELECTRICAL CONNECTIONS; MOISTURE-INDUCED STRESSES;

ANISOTROPY; COMPUTER SIMULATION; CONDUCTIVE FILMS; FINITE ELEMENT METHOD; MOISTURE; SWELLING;

FLIP CHIP DEVICES;

EID: 33646338648     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910610665107     Document Type: Review

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