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Journal of Materials Science

Volumn 46, Issue 16, 2011, Pages 5305-5323

Overview of transient liquid phase and partial transient liquid phase bonding

(2) Cook III, Grant O a Sorensen, Carl D a

a BRIGHAM YOUNG UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PROCESS; BONDING TEMPERATURES; BONDING TIME; HIGHER MELTING POINTS; INTERLAYER THICKNESS; ISOTHERMAL SOLIDIFICATION; MULTIPLE LAYERS; NI-BASED SUPERALLOYS; OPTIMAL BONDING; PARTIAL TRANSIENT LIQUID PHASE BONDINGS; SUBSTRATE MATERIAL; TLP BONDING; TRANSIENT LIQUID PHASE; TRANSIENT LIQUID PHASE BONDING;

LIQUIDS; MELTING;

BONDING;

EID: 79958185087 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-011-5561-1 Document Type: Review

Times cited : (407)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.