Transient liquid phase bonding of Cu to Cu-W composite using an electron beam energy source

International Journal of Refractory Metals and Hard Materials

Volumn 25, Issue 1, 2007, Pages 67-71

  Brochu, M ^a   Wanjara, P ^a  

^a NATIONAL RESEARCH COUNCIL CANADA   (Canada)

Author keywords

Composite; Copper; Electron beam welding; Transient liquid phase bonding; Tungsten

Indexed keywords

CHEMICAL BONDS; COPPER ALLOYS; ELECTRIC CONDUCTANCE; ELECTRIC CONTACTS; ELECTRON BEAM WELDING; ELECTRON BEAMS; MICROSTRUCTURE; PLASTIC DEFORMATION;

ELECTRON BEAM ENERGY; INTERFACIAL REGION; LIQUID PHASE BONDING; TRANSIENT LIQUID PHASE BONDING;

COMPOSITE MATERIALS;

EID: 33750392962     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2006.01.001     Document Type: Article

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