Effect of Ti on TLP bonding of SiCp/2618Al composites using interlayers of mixed Al-Ag-Cu system powders

Materials Science and Technology

Volumn 23, Issue 1, 2007, Pages 87-91

  Huang, J H ^a   Wan, Y ^a   Zhao, H T ^a   Cheng, D H ^a   Zhang, H ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Interlayer; SiCp Al composites; Ti; Transient liquid phase diffusion bonding

Indexed keywords

ALUMINUM ALLOYS; BOND STRENGTH (CHEMICAL); SILICON COMPOUNDS; TERNARY SYSTEMS; WETTING;

BONDING QUALITY; INTERLAYERS; TRANSIENT LIQUID PHASE DIFFUSION BONDING;

COMPOSITE MATERIALS;

EID: 34548814452     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328407X158460     Document Type: Article

References (17)

1. A. Urena, M. D. Escalera and L. Gil: Compos. Sci. Technol., 2000, 60, 613-622.
2. M. Chen, C. Wu and J. Wang: Trans. Chin. Weld. Inst., 2003, 24, 69-72.
3. P. P. Lean, L. Gil and A. Urena: J. Mater. Process. Technol., 2003, 143-144, 846-850.
4. R. Y. Huang, S. C. Chen and J. C. Huang: Metall. Mater. Trans. A, 2001, 32A, 2575-2584.
5. R. Gurler: J. Mater. Sdci. Lett., 1998, 17, 1543-1544.
6. T. J. Lienert, J. M. K. Wiezorek and H. L. Fraser: Proc. Conf. on 'Joining of advanced and specialty materials', 117-126; 1998, Materials Park, OH, ASM Internaltional.
7. Z. Li, W. Fearis and T. H. North: Mater. Sci. Technol., 1995, 11, 363-369.
8. Z. Li, Y. Zhou and T. H. North: J. Mater. Sci., 1995, 30, 1075-1082.
9. Y. Zhai and T. H. North: J. Mater. Sci., 1997, 32, 1393-1397.
10. A. A. Shirzadi and E. R. Wallach: Mater. Sci. Technol., 1997, 13, 135-142.
11. W. D. MacDonald and T. W. Eagar: Ann. Rev. Mater. Sci., 1992, 22, 23-46.
12. R. Klehn and T. W. Eaqer: Weld. Res. Council Bull., 1993, 385, 1-26.
13. J. R. Askew and J. F. Wilde: Mater. Sci. Technol., 1998, 14, 920-924.
14. J. H. Huang, Y. L. Dong, Y. Wan, J. G. Zhang and G. A. Zhou: Mater. Sci. Technol., 2005, 21, 1217-1221.
15. J. H. Huang, Y. L. Dong, Y. Wan, J. G. Zhang and G. A. Zhou: J. Mater. Sci. Technol., 2005, 21, 779-781.
16. J. Yan, Z. Xu, G. Wu and S. Yang: Scr. Mater., 2004, 51, 147-150.
17. Q. Zhang and H. Zhuang: 'Manual of brazing and soldering', 53; 1999, Beijing, Mechanical Industry Press.