Application of TLP(Transient Liquid Phase) bonding method to the high Tm lead-free solder

Materials Science Forum

Volumn 475-479, Issue III, 2005, Pages 1869-1872

  Lee, J S ^a   Bang, W H ^b   Jung, J P ^a   Oh, K H ^b  

^a University of Seoul   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

Electroplating; Reflow; Soldering; TLP(Transient Liquid Phase) method

Indexed keywords

BONDING; COPPER; ELECTROPLATING; HEATING; INTERMETALLICS; SOLDERING; STRENGTH OF MATERIALS; TIN ALLOYS; X RAY ANALYSIS;

COLLOIDAL SUSPENSION; CROSS-SECTION; REFLOW; TRANSIENT LIQUID PHASE (TLP) METHODS; WETTING PERFORMANCE;

SOLDERING ALLOYS;

EID: 17044383821     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-960-1.1869     Document Type: Conference Paper

References (4)

1. X.Qiao, S.F. Corbin: Mat. Sci. Eng., Vol. A283, (2000) p. 38
2. T. Korhonen, V. Vuorinen, and J.K. Kivilaht:, IEEE Trans. Vol.24, (2001) p. 515
3. J.H. Lee, D.H. Shin and Y.S. Kim: Met. Mater. Int. Vol.9 (2003), p.577
4. Ann A. Liu, H.K. Kim, and K.N.Tu: J. Appl. Phys, Vol. 80 (1996) p. 2774