Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers

Journal of Electronic Materials

Volumn 32, Issue 9, 2003, Pages 952-956

  Liang, M W ^a   Hsieh, T E ^a   Chang, S Y ^b   Chuang, T H ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Bonding strength; Die attachment; Diffusion soldering; Intermetallic compounds; Kinetics analysis

Indexed keywords

ACTIVATION ENERGY; ALUMINA; BOND STRENGTH (MATERIALS); GROWTH (MATERIALS); INTERFACES (MATERIALS); RATE CONSTANTS; SILICON; SOLDERING; TEMPERATURE; TENSILE STRENGTH; TIN;

DIE ATTACHMENT; DIFFUSION SOLDERING; KINETIC ANALYSIS; THIN-FILM REACTIONS;

INTERMETALLICS;

EID: 0141676003     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0229-5     Document Type: Article

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